TYPE | DESCRIPTION |
Factory Lead Time
| 8 Weeks |
Mount
| PCB, Through Hole |
Mounting Type
| Through Hole |
Package / Case
| Radial |
Terminal Shape
| WIRE |
Number of Pins
| 322 |
Dielectric Material | Ceramic |
Weight
| 453.59237mg |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published
| 2005 |
Series
| GoldMax 300 Comm C0G |
Size / Dimension
| 0.200Lx0.125W 5.08mmx3.18mm |
Tolerance
| ±5% |
JESD-609 Code
| e3 |
Feature
| Low ESL |
Pbfree Code
| yes |
Part Status | Active |
Moisture Sensitivity Level (MSL)
| 1 (Unlimited) |
Number of Terminations
| 2 |
ECCN Code
| EAR99 |
Temperature Coefficient | C0G NP0 |
Terminal Finish
| Matte Tin (Sn) - with Nickel (Ni) barrier |
Applications
| General Purpose |
HTS Code | 8532.24.00.60 |
Capacitance
| 1000pF |
Voltage - Rated DC
| 100V |
Depth
| 3.18mm |
Lead Pitch
| 5.08mm |
Lead Length
| 7mm |
Dielectric
| C0G |
Lead Spacing | 0.200 5.08mm |
Temperature Characteristics Code
| C0G |
Multilayer
| Yes |
Lead Diameter
| 510 μm |
Size Code
| 2012 |
Voltage
| 100V |
Lead Style
| Formed Leads |
Dissipation Factor | 0.1 % |
Lead/Base Style
| Formed Leads |
Height
| 3.18mm |
Height Seated (Max)
| 0.260 6.60mm |
Radiation Hardening | No |
REACH SVHC
| No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free
| Lead Free |