TYPE | DESCRIPTION |
Factory Lead Time
| 34 Weeks |
Mount
| PCB, Surface Mount |
Mounting Type
| Surface Mount, MLCC |
Package / Case
| 0603 (1608 Metric) |
Terminal Shape
| WRAPAROUND |
Number of Pins
| 2 |
Dielectric Material | Ceramic |
Operating Temperature | -55°C~125°C |
Packaging | Tape & Reel (TR) |
Published
| 2013 |
Series
| SMD Comm C0G |
Size / Dimension
| 0.063Lx0.031W 1.60mmx0.80mm |
Tolerance
| ±0.25pF |
JESD-609 Code
| e3 |
Feature
| Low ESL |
Pbfree Code
| yes |
Part Status | Active |
Moisture Sensitivity Level (MSL)
| 1 (Unlimited) |
Number of Terminations
| 2 |
Termination
| SMD/SMT |
ECCN Code
| EAR99 |
Temperature Coefficient | C0G NP0 |
Terminal Finish
| Matte Tin (Sn) - with Nickel (Ni) barrier |
Applications
| General Purpose |
Capacitance
| 5.6pF |
Voltage - Rated DC
| 50V |
Packing Method
| TR, PAPER, 7 INCH |
Depth
| 800μm |
Case Code (Metric)
| 1608 |
Case Code (Imperial)
| 0603 |
Lead Pitch
| 700μm |
Dielectric
| C0G |
Temperature Characteristics Code
| C0G |
Multilayer
| Yes |
Voltage
| 16V |
Dissipation Factor | 0.1 % |
Height
| 870μm |
Length
| 1.6mm |
Width
| 0.8mm |
Thickness (Max)
| 0.034 0.87mm |
Thickness
| 863.6μm |
Radiation Hardening | No |
REACH SVHC
| No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free
| Lead Free |